Apple + Broadcom，官宣！

蘋果斥資 300 億美元加碼博通，大力推進美國本土芯片制造
核心要點

1. 蘋果擴大與博通的合作規模，達成一筆總額超 300 億美元的芯片生產協議，這也是蘋果迄今為止在美國本土制造領域最大規模投入。

2. 該合作計劃在美國本土生產超 150 億顆芯片，其中包含 15 億美元資金用于擴建博通位于科羅拉多州柯林斯堡的工廠。

3. 即將卸任的蘋果首席執行官蒂姆?庫克此番動作，是其近期主推本土制造的又一舉措，而本土制造也是本屆政府重點推進的核心議題。

加利福尼亞州庫比蒂諾訊 —— 蘋果今日宣布，與博通達成一份全新多年合作協議，雙方將為蘋果全系多款產品定制研發、生產專用硅芯片元件與前沿無線連接技術。這份協議總投入預計超 300 億美元，將在美國本土生產超 150 億顆芯片，創造數百個美國就業崗位。蘋果長期與美國政府及本土企業協作，搭建完整的美國本土芯片全產業鏈，本次合作公告將進一步推進該目標落地。

博通是蘋果 “美國制造計劃（AMP）” 合作企業，該計劃于去年啟動，旨在推動美國本土制造業發展。本次合作是蘋果迄今為止在 AMP 框架下規模最大的一筆投入。博通將斥資 15 億美元，對其位于科羅拉多州柯林斯堡的生產基地進行擴建與設備升級。這座工廠將量產先進射頻元器件（含體聲波濾波器 FBAR）以及新一代無線連接技術產品。

蘋果首席執行官蒂姆?庫克表示：“蘋果與博通擁有長期合作根基，本次全新合作階段，將進一步加快我們布局美國本土制造、深耕技術創新的步伐。柯林斯堡工廠產出的高端元器件，是保障產品擁有出眾性能與穩定連接能力的核心。我們十分榮幸，能持續加大對秉持高標準、深耕創新的美國本土供應商的投入，也感謝總統及政府部門對這類重點產業項目提供支持?！?/p>

博通總裁兼首席執行官陳福陽（Hock Tan）稱：“數十年來，博通與蘋果合作成果豐碩，我們很榮幸延續雙方合作，并且同樣堅定支持美國本土技術創新。依托蘋果本次大額合作訂單，我們將擴大柯林斯堡工廠生產規模，在這里研發制造能夠聯通全球的前沿科技產品?！?/p>

本次合作相關投入，均納入蘋果四年內向美國經濟投入 6000 億美元的整體規劃，資金將用于扶持本土制造業、創造就業、推進全國范圍的技術研發。

英文如下：

Apple to increase spend with Broadcom to produce billions more U.S. chips

New multiyear agreement includes expansion to facility in Fort Collins, Colorado

Apple today announced a new multiyear commitment with Broadcom to design and produce custom silicon components and cutting-edge wireless connectivity technologies for a wide range of Apple products. The new agreement, expected to exceed $30 billion, will lead to the production of more than 15 billion U.S.-made chips and support hundreds of American jobs. Apple has been working with the administration and businesses across the U.S. to help create an end-to-end silicon supply chain in America, and today’s announcement advances those efforts.

Broadcom is part of Apple’s American Manufacturing Program (AMP), launched last year to accelerate manufacturing in the U.S. This new agreement, which marks Apple’s largest AMP commitment to date, will enable Broadcom to expand and modernize its manufacturing facilities in Fort Collins, Colorado, with a $1.5 billion capital expenditure investment. Broadcom will produce advanced radio frequency components — including FBAR filters — and advanced wireless connectivity technologies at the Fort Collins facility.

“Apple and Broadcom have a long history together, and this new phase of our partnership further accelerates our commitment to American manufacturing and innovation,” said Tim Cook, Apple’s CEO. “The cutting-edge components built in Fort Collins are essential to delivering the incredible performance and connectivity our customers expect, and we’re proud to deepen our investments in U.S.-based suppliers that share our commitment to excellence and innovation. We’re grateful to the president and his administration for supporting important projects like this one.”

“Broadcom is proud to continue to work with Apple after decades of success together, and we share a strong commitment to American innovation,” said Hock Tan, Broadcom’s president and CEO. “With Apple’s newest commitment, we’re pleased to expand our manufacturing footprint in Fort Collins, where we create groundbreaking technology that connects people around the world.”

These investments are part of Apple’s commitment to invest $600 billion in the U.S. economy over four years, supporting manufacturing, job creation, and technology development across the country.

歡迎報名：ICDIA 2026 （第六屆中國集成電路創芯大會）